Patents/Inventors

Kai Jen

TaichungTW11 patents

11 Patents

US123100002025
Manufacturing Method of Semiconductor Device
Windbond Electronics Corp.
0 cites
US121932212025
Semiconductor Structure and Method for Forming the Same
WINBOND ELECTRONICS Corp.
0 cites
US121071622024
Multi-gate Semiconductor Structure and Method of Manufacturing the Same
WINBOND ELECTRONICS Corp.
0 cites
US120893942024
Semiconductor Structure
Winbond Electronics Corp.
0 cites
US120209452024
Dynamic Random Access Memory and Method for Manufacturing the Same
WINBOND ELECTRONICS Corp.
0 cites
US120161732024
Semiconductor Device and Manufacturing Method Thereof
Winbond Electronics Corp.
0 cites
US119439132024
Method of Manufacturing Semiconductor Structure Having Multi-work Function Gate Electrode
WINBOND ELECTRONICS Corp.
0 cites
US119234492024
Manufacturing Method for Semiconductor Device
Winbond Electronics Corp.
0 cites
US117840872023
Semiconductor Structure Having Layers in a Trench and Method of Manufacturing the Same
WINBOND ELECTRONICS Corp.
0 cites
US117658882023
Methods of Manufacturing Dynamic Random Access Memory
Winbond Electronics Corp.
0 cites
US116658792023
Method of Manufacturing Dynamic Random-access Memory
Winbond Electronics Corp.
0 cites