Kabir Mirpuri

8 Patents

• US124068962025

  Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor

  NXP USA, Inc.

  0 cites
• US121990642025

  Substrate Pad and Die Pillar Design Modifications to Enable Extreme Fine Pitch Flip Chip (FC) Joints

  NXP USA, Inc.

  0 cites
• US119358092024

  Semiconductor Package Thermal Spreader Having Integrated EF/EMI Shielding and Antenna Elements

  NXP USA, Inc.

  0 cites
• US118759882024

  Substrate Pad and Die Pillar Design Modifications to Enable Extreme Fine Pitch Flip Chip (FC) Joints

  NXP USA, Inc.

  0 cites
• US118173662023

  Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor

  NXP USA, Inc.

  0 cites
• US117216422023

  Semiconductor Device Package Connector Structure and Method Therefor

  NXP USA, Inc.

  0 cites
• US117054102023

  Semiconductor Device Having Integrated Antenna and Method Therefor

  NXP USA, Inc.

  0 cites
• US115575252023

  Semiconductor Package Thermal Spreader Having Integrated RF/EMI Shielding and Antenna Elements

  NXP USA, Inc.

  0 cites