Patents/Inventors

Jyun-siang Peng

HsinchuTW8 patents

9 Patents

US123811762025
Semiconductor Structure Having a Conductive Feature Comprising an Adhesion Layer and a Metal Region Over and Contacting the Adhesion Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123623092025
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120210262024
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119963812024
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117568792023
Semiconductor Devices and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117423172023
Process Including a Re-etching Process for Forming a Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116705822023
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115879022023
Semiconductor Structure and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115575612023
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites