Jyun-lin Wu

6 Patents

• US124427422025

  Test Structures to Determine Integrated Circuit Bonding Energies and Methods of Making and Using the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites
• US124245582025

  Bridge Die Having Different Surface Orientation Than IC Dies Interconnected by the Bridge Die

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US123825872025

  Methods and Systems for Improving Surface Mount Joinder

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US123622462025

  Interposer Including Stepped Surfaces and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites
• US123623072025

  Semiconductor Package with Ball Grid Array Connection Having Improved Reliability

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US120683002024

  Chip-on-wafer-on-substrate Package with Improved Yield

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites