Jyh-nan Lin

6 Patents

• US124446472025

  Electron Migration Control in Interconnect Structures

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123549072025

  Electron Migration Control in Interconnect Structures

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123549082025

  Amorphous Layers for Reducing Copper Diffusion and Method Forming Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US121486562024

  Method of Manufacturing Semiconductor Device and Semiconductor Devices

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US119675222024

  Amorphous Layers for Reducing Copper Diffusion and Method Forming Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US117423932023

  Semiconductor Device Having a Multi-layer Diffusion Barrier and Method of Making the Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites