3 Patents
- US125327472026Semiconductor Package and Package-on-package Having Different Wiring Insulating Layers Surrounding Differential Signal Wiring Layers
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124827642025Semiconductor Package Including Power Plane Connecting Power Terminal of Passive Device Unit and Dummy Bump of Interposer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122551602025Semiconductor Package and Package-on-package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites