15 Patents
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- US124245022025Integrated Circuit Package with Heat Transfer Chimney Including Thermally Conductive Nanoparticles
Microchip Technology Incorporated
0 cites - US122058852025Metal-oxide-metal (MOM) Capacitors for Integrated Circuit Monitoring
Microchip Technology Incorporated
0 cites - US122059102025Integrated Circuit Bond Pad with Multi-material Toothed Structure
Microchip Technology Incorporated
0 cites - US120402822024Electronic Device Including Interposers Bonded to Each Other
Microchip Technology Incorporated
0 cites - US119358242024Integrated Circuit Package Module Including a Bonding System
Microchip Technology Incorporated
0 cites - US117355162023Metal-oxide-metal (MOM) Capacitors for Integrated Circuit Monitoring
Microchip Technology Incorporated
0 cites - US117232222023Integrated Circuit (IC) Package with Integrated Inductor Having Core Magnetic Field (B Field) Extending Parallel to Substrate
Microchip Technology Incorporated
0 cites - US117157572023Three-dimensional Metal-insulator-metal (MIM) Capacitor
Microchip Technology Incorporated
0 cites - US116826412023Integrated Circuit Bond Pad with Multi-material Toothed Structure
Microchip Technology Incorporated
0 cites - US116826422023Integrated Circuit (IC) Device Including a Force Mitigation System for Reducing Under-pad Damage Caused by Wire Bond
Microchip Technology Incorporated
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- US115455442023Three-dimensional Metal-insulator-metal (MIM) Capacitor
Microchip Technology Incorporated
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