Patents/Inventors

Junyeong Heo

Suwon-siKR7 patents

8 Patents

US124068882025
Semiconductor Substrate and Method of Dicing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123550042025
Semiconductor Chip and Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120947942024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US119963672024
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358322024
Semiconductor Device and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US118698212024
Semiconductor Package Having Molding Layer with Inclined Side Wall
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117216692023
Semiconductor Package Including a First Semiconductor Stack and a Second Semiconductor Stack of Different Widths
SAMSUNG ELECTRONICS CO, Ltd.
0 cites
US116949632023
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites