12 Patents
- US125753732026Wafer Thinning Tape and Preparation Method Thereof, and Wafer Grinding Method
WUHAN CHOICE TECHNOLOGY CO., Ltd
0 cites - US122526132025Packaging Film and Preparation Method Thereof, and Filter Chip Packaging Method
WUHAN CHOICE TECHNOLOGY CO., Ltd.
0 cites - US122551752025Wafer Warpage Regulation Epoxy Functional Film, and Preparation Method and Application Thereof
Wuhan Sanxuan Technology Co., Ltd
0 cites - US122091712025Liquid Epoxy Molding Compound and Preparation Method Thereof
Hubei Choice Technology Co., Ltd.
0 cites - US120982302024Build-up Film with Low Dielectric Loss, Preparation Method Therefor and Circuit Substrate Structure
WUHAN CHOICE TECHNOLOGY CO, Ltd
0 cites - US120374882024Liquid Molding Compound and Preparation Method Thereof
Hubei Choice Technology Co., Ltd.
0 cites - US120245912024Modification Method of Polyphenylene Ether Resin, Laminated Film Composite, Laminated Film, and Substrate
Wuhan Choice Technology Co, Ltd
0 cites - US119786862024Chip Protective Film and Method for Manufacturing Same, and Chip
Wuhan Choice Technology Co, Ltd.
0 cites - 0 cites
- US118044632023Underfill for Chip Packaging and Chip Packaging Structure
Wuhan Choice Technology Co, Ltd
0 cites - US117674502023Adhesive, Die Attach Film and Preparation Method Therefor
Wuhan Choice Technology Co, Ltd
0 cites - US116434992023Liquid Molding Compound for Protecting Five Edges of Semiconductor Chip and Preparation Method Thereof
HUBEI CHOICE TECHNOLOGY CO., Ltd.
0 cites