Patents/Inventors

Junso Pak

Seongnam-siKR2 patents

4 Patents

US122242602025
Semiconductor Package Including a Dualized Signal Wiring Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122132562025
Semiconductor Package for Improving Power Integrity Characteristics
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119087582024
Semiconductor Package Including Dual Stiffener
Samsung Electronics Co., Ltd.
0 cites
US119088102024
Hybrid Semiconductor Device and Electronic Device
Samsung Electronics Co., Ltd.
0 cites