Patents
.us
Search
Marketplace
Patent My Idea
Patents
/
Inventors
Junshi Soeda
Osaka
JP
0 patents
1 Patent
US12049066
2024
Composite of Thermally-modified Polymer Layer and Inorganic Substrate, Composite of Polymer Member and Inorganic Substrate, and Production Methods Thereof
TEIJIN LIMITED
0 cites