Patents/Inventors

Junrong Yan

ShanghaiCN9 patents

9 Patents

US125060152025
Semiconductor Wafer Thinned by Horizontal Stealth Lasing
Sandisk Technologies, Inc.
0 cites
US125060362025
Dicing and Wafer Thinning to Form Semiconductor Dies
Sandisk Technologies, Inc.
0 cites
US124630972025
Semiconductor Device with Reduced Stress Die Pick and Place
Sandisk Technologies, Inc.
0 cites
US120837152024
Mold Compound Dispensing System and Method
Morgan, Lewis & Bockius LLP
0 cites
US119013272024
Wire Bonding for Semiconductor Devices
WESTERN DIGITAL TECHNOLOGIES, Inc.
0 cites
US118943432024
Vertical Semiconductor Device with Side Grooves
Western Digital Technologies, Inc.
0 cites
US117833462023
Blockchain Enabled Collaborative Transaction Information Processing for a Supply Chain
General Electric Company
0 cites
US117569322023
Sloped Interconnector for Stacked Die Package
SANDISK TECHNOLOGIES LLC
0 cites
US117496472023
Semiconductor Device Including Vertical Wire Bonds
Western Digital Technologies, Inc.
0 cites