13 Patents
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- US121547152024Methods to Selectively Embed Magnetic Materials in Substrate and Corresponding Structures
Intel Corporation
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- US117355372023Methods to Embed Magnetic Material as First Layer on Coreless Substrates and Corresponding Structures
Intel Corporation
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- US116964072023Core Layer with Fully Encapsulated Co-axial Magnetic Material Around PTH in IC Package Substrate
Intel Corporation
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