Patents/Inventors

Junichi Kakehata

TokyoJP1 patent

2 Patents

US122463982025
Solder Bump Forming Member, Method for Manufacturing Solder Bump Forming Member, and Method for Manufacturing Electrode Substrate Provided with Solder Bump
RESONAC CORPORATION
0 cites
US121009232024
Connection Structure and Manufacturing Method Therefor
RESONAC CORPORATION
0 cites