29 Patents
- US125816532026Semiconductor Devices and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites - US125324722026Three-dimensional Semiconductor Memory Device and Electronic System Including the Same
Samsung Electronics Co., Ltd.
0 cites - US125001712025Non-volatile Memory Devices with Dummy Channel Structures in Contact Region and Associated Systems
Samsung Electronics Co., Ltd.
0 cites - US124761912025Semiconductor Devices and Data Storage Systems Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124143012025Semiconductor Device and Data Storage System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124023162025Semiconductor Device and Data Storage System Including the Same
Samsung Electronics Co., Ltd.
0 cites - US124023172025Semiconductor Devices and Data Storage Systems Including the Same
Samsung Electronics Co., Ltd.
0 cites - US123961742025Semiconductor Device and Data Storage System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123680992025Semiconductor Device and Electronic System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123638992025Semiconductor Devices and Data Storage Systems Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US123493482025Semiconductor Device Including Support Structure, Method for Manufacturing the Same and Electronic System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122951412025Memory Device with Metal Pad Pattern and System Including the Same
Samsung Electronics Co., Ltd.
0 cites - US122074692025Vertical Memory Devices and Methods of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122009302025Semiconductor Devices and Data Storage Systems Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US121659762024Three-dimensional Semiconductor Device Including a Through-via Structure Having a via Liner Having Protruding Portions
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US121333812024Semiconductor Devices and Data Storage Systems Including the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
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- US116264132023Semiconductor Device Including Gate Layer and Vertical Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites