Patents/Inventors

Jungsoo Byun

Suwon-siKR2 patents

3 Patents

US122180992025
Interposer and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120150142024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812632023
Semiconductor Package, and Package on Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites