Jungsik Lee

4 Patents

• US123006682025

  Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US121775542024

  Camera Module

  LG INNOTEK CO., Ltd.

  0 cites
• US119172802024

  Camera Module Comprising a Base Comprising a Rib Between a Lower Spring and a Shield Can

  LG INNOTEK CO., Ltd.

  0 cites
• US116472712023

  Camera Module Comprising a Base Comprising a Rib Between a Lower Spring and a Shield Can

  LG INNOTEK CO., Ltd.

  0 cites