Patents/Inventors

Jungjoo Kim

Suwon-siKR13 patents

12 Patents

US125507392026
Semiconductor Package Including a Metal Plate and Package-on-package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124944392025
Semiconductor Packages Having Fixing Members
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124631262025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US124566602025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124514372025
Semiconductor Packages Having Fixing Members
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124381342025
Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124009702025
Semiconductor Package Including Electromagnetic Shield Structure
Samsung Electronics Co., Ltd.
0 cites
US123082532025
Molded Product for Semiconductor Strip and Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122887432025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122059252025
Semiconductor Package Having Package Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120876502024
Interposer and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US116886562023
Interposer and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites