14 Patents
- US125735222026Thin-film Structure and Semiconductor Device Comprising the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US124697902025Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123826702025Thin Film Structure and Semiconductor Device Comprising the Same
Samsung Electronics Co., Ltd.
0 cites - US122132562025Semiconductor Package for Improving Power Integrity Characteristics
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US119359162024Dielectric Thin-film Structure and Electronic Device Including the Same
Samsung Electronics Co., Ltd.
0 cites - US118549852023Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US117641822023Semiconductor Package and Semiconductor Device Including the Same
Samsung Electronics Co., Ltd.
0 cites - US117282742023Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US116580242023Semiconductor Device and Method of Manufacturing the Same
Samsung Electronics Co.. Ltd.
0 cites - US115693412023Dielectric Thin-film Structure and Electronic Device Including the Same
Samsung Electronics Co., Ltd.
0 cites