Patents/Inventors

Junghoon Kang

Anyang-siKR9 patents

9 Patents

US125507472026
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US124889962025
Semiconductor Package Having Pad Pattern Including Plastically Deformed Metal Film
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123746672025
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US123411182025
Semiconductor Package Including an Encapsulant
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122305802025
Method of Manufacturing Semiconductor Package, and Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121006682024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119293152024
Semiconductor Package Having Pad with Regular and Irregular Depressions and Protrusions and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US118375532023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117988142023
Semiconductor Package, Electronic Apparatus and Method of Manufacturing the Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites