Patents/Inventors

Junggon Choi

Seongnam-siKR2 patents

3 Patents

US117282832023
Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116769152023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812632023
Semiconductor Package, and Package on Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites