Patents/Inventors

Junggeun Shin

Suwon-siKR3 patents

4 Patents

US124128242025
Semiconductor Packages and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US120626262024
Semiconductor Substrate and Method of Sawing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118548922023
Substrate Dicing Method, Method of Fabricating Semiconductor Device, and Semiconductor Chip Fabricated by Them
Samsung Electronics Co., Ltd.
0 cites
US116769142023
Semiconductor Substrate and Method of Sawing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites