3 Patents
- US121441242024Low-roughness Surface-treated Copper Foil with Low Bending Deformation, Copper Clad Laminate Comprising Same, and Printed Wiring Board
Lotte Energy Materials Corporation
0 cites - 0 cites
- US116224452023Surface-treated Copper Foil, Manufacturing Method Thereof, Copper Foil Laminate Including the Same, and Printed Wiring Board Including the Same
ILJIN MATERIALS CO., Ltd.
0 cites