41 Patents
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- US125557202026Multilayer Electronic Component with Enhanced Electrode Connectivity Using Ni and Al Oxide
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US124445382025Multilayer Electronic Component Having External Electrode Which Includes Resin Layer and Conductive Resin Layer
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US123548072025Multilayer Electronic Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US122664792025Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US122575862025Porous Particle Composite for PCR with Heat Dissipation Function
Korea Institute Of Science And Technology
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- US122204482025Method of Treating Pathogenic Bacterial Infectious Diseases
KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
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- USD10541052024Body of Nail Clipper0 cites
- US121485742024Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US121026662024Use of Recombinant Antibacterial Protein Ablysin for Effectively Killing Multidrug-resistant Pathogenic Bacteria
KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
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- US120091542024Multilayer Electronic Component with Conductive Resin Layer
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US119526872024Method for Producing Cell-culturing Polyvinyl Alcohol Nanofiber Structure
NANOFAENTECH CO., Ltd.
0 cites - US119357032024Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US119011312024Multilayer Ceramic Electronic Component Including External Electrodes Having Improved Reliability
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US118043272023Coil Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US117840052023Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US116741542023Gene Therapeutics for Fibrodysplasia Ossificans Progressiva
University Of Massachusetts
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- US116369842023Multilayer Electronic Component Including Non-conductive Resin Layer on Body Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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