Patents/Inventors

Jung Kyu Han

Chandler, AZUS22 patents

13 Patents

US126047482026
Capacitor Pads and Methods of Manufacturing the Same
Intel Corporation
0 cites
US125936952026
Structure and Process for Warpage Reduction
INTEL CORPORATION
0 cites
US125688312026
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US124762142025
Solder Interconnect Hierarchy for Heterogeneous Electronic Device Packaging
Intel Corporation
0 cites
US123548832025
Omni Directional Interconnect with Magnetic Fillers in Mold Matrix
Intel Corporation
0 cites
US123411172025
Methods and Apparatus to Reduce Defects in Interconnects Between Semiconductor Dies and Package Substrates
Intel Corporation
0 cites
US123344222025
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Intel Corporation
0 cites
US122377592025
High-efficiency Integrated Power Circuit with Reduced Number of Semiconductor Elements and Multiple Output Ports
Korea Aerospace Research Institute
0 cites
US120604852024
Low Gloss Non-coating Thermoplastic Resin Composition, Method for Manufacturing Molded Article by Using the Same, and Molded Article Manufactured Through the Same
Samyang Corporation
0 cites
US119554482024
Architecture to Manage FLI Bump Height Delta and Reliability Needs for Mixed EMIB Pitches
Intel Corporation
0 cites
US119358572024
Surface Finishes with Low RBTV for Fine and Mixed Bump Pitch Architectures
Intel Corporation
0 cites
US119233122024
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US116996482023
Electromigration Resistant and Profile Consistent Contact Arrays
Tahoe Research, Ltd.
0 cites