8 Patents
- US126047372026Electronic Assembly Comprising Metal Foil Layer Exposing Solder Bumps and Method for Fabricating the Same
3M Innovative Properties Company
0 cites - US124712632025Multilayer Tape Including Plurality of Magnetic Metal Particles and Electronic Assembly Including the Same
3M INNOVATIVE PROPERTIES COMPANY
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- US120682582024Method for Fabricating Electronic Assembly Including a Magnetic Field Shielding Film
3M INNOVATIVE PROPERTIES COMPANY
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