Jung Hyuk Jung

8 Patents

• US124379112025

  Coil Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US123409322025

  Coil Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US123081502025

  Coil Electronic Component and Method of Manufacturing the Same

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US121485612024

  Coil Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US117214742023

  Coil Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US116159112023

  Coil Component Having Dual Insulating Structure

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US116107242023

  Coil Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US116054842023

  Multilayer Seed Pattern Inductor and Manufacturing Method Thereof

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites