Patents/Inventors

Jung-hua Chang

HsinchuTW26 patents

26 Patents

US124890452025
Package Structure with Through Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124216002025
2-in-1 (uv-assisted and Plasma Enhanced) ALD and ALE Chamber
SKY TECH Inc.
0 cites
US124096122025
Bonding Method and Apparatus of Substrates
SKY TECH Inc.
0 cites
US124036852025
Plate Cooling Device and De-bonding Station with Plate Cooling Device
SKY TECH Inc.
0 cites
US123811142025
Package Structure with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123681232025
Package Structure Including Stacked Pillar Portions and Method for Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122726632025
Metal-bump Sidewall Protection
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122648172025
Manufacturing Method of Optical Device, Optical Device with Quantum Dots, and Illumination Apparatus with Quantum Dots
QDLUX Inc.
0 cites
US122551732025
Chip Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121257212024
Parallelism-adjustable Bonding Machine
SKY TECH Inc.
0 cites
US120402152024
Bonding Machine with Movable Suction Modules
SKY TECH Inc.
0 cites
US120312082024
Atomic Layer Deposition Apparatus for Powders
SKY TECH Inc.
0 cites
US120339682024
Package Structure Including Stacked Pillar Portions
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120065712024
Atomic Layer Deposition Apparatus for Coating on Fine Powders
SKY TECH Inc.
0 cites
US119878832024
Powder Atomic Layer Deposition Apparatus for Blowing Powders
SKY TECH Inc.
0 cites
US119617532024
Substrate-bonding Device
SKY TECH Inc.
0 cites
US119526622024
Powder Atomic Layer Deposition Equipment with Quick Release Function
SKY TECH Inc.
0 cites
US119488762024
Package Structure with Through Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118550392023
Chip Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117840912023
Structure and Formation Method of Chip Package with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117733192023
Quantum Dot Particles with Passivation Layer and Manufacturing Method Thereof
SKY TECH Inc.
0 cites
US117675912023
Detachable Atomic Layer Deposition Apparatus for Powders
SKY TECH Inc.
0 cites
US117394232023
Atomic Layer Deposition Apparatus for Coating on Fine Powders
SKY TECH Inc.
0 cites
US117354562023
Alignment Mechanism and Alignment Method of Bonding Machine
SKY TECH Inc.
0 cites
US116826452023
Plurality of Stacked Pillar Portions on a Semiconductor Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115691592023
Structure and Formation Method of Chip Package with Through Vias
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites