Patents/Inventors

Jung Eun Koo

Hwaseong-siKR1 patent

2 Patents

US121762962024
Semiconductor Package and Electronic Device Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115860792023
Film Type Package Comprising a Plurality of Test Lines and a Plurality of First and Second Connection Pads and Display Apparatus Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites