Jun Kyu Lee

12 Patents

• US125575902026

  Substrate Transfer Device, Substrate Transfer System and Substrate Transfer Method

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US124798402025

  Hmg-coa Reductase Degradation Inducing Compound

  UPPTHERA Inc.

  0 cites
• US123346942025

  Electric Appliance and Adapter

  SOLUM CO., Ltd.

  0 cites
• US122059042025

  Wafer-level Design and Wiring Pattern for a Semiconductor Package

  Nepes Co., Ltd.

  0 cites
• US121989972025

  Semiconductor Package Comprising First Molding Layer and Second Molding Layer with Different Thermal Expansion Coefficients

  NEPES CO., Ltd.

  0 cites
• US120289852024

  Electrical Device Having Heat Dissipation Structure Using Filler and Manufacturing Method of the Same

  SOLUM CO., Ltd.

  0 cites
• US119557552024

  Electric Appliance and Adapter

  SOLUM CO., Ltd.

  0 cites
• US119393342024

  Substituted Pyrimido[4,5-b][1,4]diazepines as PLK1 Degradation Inducers

  UPPTHERA, Inc.

  0 cites
• US119127102024

  Substituted Pyrimido[4,5-b][1,4]diazepines as PLK1 Degradation Inducers

  UPPTHERA, Inc.

  0 cites
• US118981882024

  Mutant Microorganism Having Ability to Produce 1,3-propanediol, and Method for Preparing 1,3-PDO by Using Same

  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

  0 cites
• US118255992023

  Air-pocket Prevention PCB, Air-pocket Prevention PCB Module, Electrical Device Including the Same, and Manufacturing Method of Electrical Device Including the Same

  SOLUM CO., Ltd.

  0 cites
• US117839892023

  Transformer

  ATUM CO., Ltd.

  0 cites