Patents/Inventors

Jun Hyeong Jang

Suwon-siKR1 patent

2 Patents

US123895462025
Printed Circuit Board, Electronic Component-embedded Substrate, and Manufacturing Method Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US116409522023
Electronic Component Embedded Substrate
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites