Patents/Inventors

Jun Chung Hsu

Cupertino, CAUS4 patents

5 Patents

US124944332025
3D Embedded Redistribution Layers for IC Substrate Packaging
Apple Inc.
0 cites
US123227212025
Asymmetric Stackup Structure for Soc Package Substrates
Apple Inc.
0 cites
US119088192024
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinforcement Structures
Apple Inc.
0 cites
US118625972024
Asymmetric Stackup Structure for Soc Package Substrates
Apple Inc.
0 cites
US115454552023
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinforcement Structures
Apple Inc.
0 cites