4 Patents
- US122059102025Integrated Circuit Bond Pad with Multi-material Toothed Structure
Microchip Technology Incorporated
0 cites - US120402822024Electronic Device Including Interposers Bonded to Each Other
Microchip Technology Incorporated
0 cites - US119358242024Integrated Circuit Package Module Including a Bonding System
Microchip Technology Incorporated
0 cites - US116826412023Integrated Circuit Bond Pad with Multi-material Toothed Structure
Microchip Technology Incorporated
0 cites