7 Patents
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- US124567022025Device, Method and System to Mitigate Stress on Hybrid Bonds in a Multi-tier Arrangement of Chiplets
Intel Corporation
0 cites - US123797692025System, Apparatus and Method for Dynamic Thermal Distribution of a System on Chip
Intel Corporation
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- US116566762023System, Apparatus and Method for Dynamic Thermal Distribution of a System on Chip
Intel Corporation
0 cites