Juik Lee

6 Patents

• US123477472025

  Semiconductor Devices Including a Through-hole Electrode

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US122887342025

  Semiconductor Device

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US121598592024

  Thermal Pad, Semiconductor Chip Including the Same and Method of Manufacturing the Semiconductor Chip

  Samsung Electronics Co., Ltd.

  0 cites
• US120402312024

  Semiconductor Device Including TSV and Multiple Insulating Layers

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US117697422023

  Semiconductor Chip and Semiconductor Package Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116160182023

  Semiconductor Devices Including a Thick Metal Layer

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites