11 Patents
- 0 cites
- US125988212026Chip Package Structure and Method for Producing the Same
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US125466912026Force and Vibration Measurement Device with Function of Providing Adjustable Force
PRIMAX ELECTRONICS Ltd.
0 cites - US122243592025Sensor Package Structure Having Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
- US119845162024Sensor Package Structure Having Ring-shaped Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US119833632024User Gesture Behavior Simulation System and User Gesture Behavior Simulation Method Applied Thereto
PRIMAX ELECTRONICS Ltd.
0 cites - US119676522024Sensor Package Structure Having Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US117924972023Sensor Lens Assembly Having Non-reflow Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
- US117231472023Sensor Lens Assembly Having Non-reflow Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites