Patents/Inventors

Juhyun Lyu

Cheonan-siKR2 patents

3 Patents

US117354942023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US116705652023
Semiconductor Package with Heat Dissipation Member
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691452023
Semiconductor Package with Thermal Interface Material for Improving Package Reliability
SAMSUNG ELECTRONICS CO., Ltd.
0 cites