Patents/Inventors

Juhyeon Oh

Asan-siKR3 patents

4 Patents

US124069342025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121320072024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120573572024
Semiconductor Package Including Plurality of Recesses and Molding Member with Plurality of Protrusions That Fill the Recesses
SAMSUNG ELECTRONICS CO, Ltd.
0 cites
US115812662023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites