3 Patents
- US125989912026Liquid Circulating Cooling Package Substrate and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US125507742026Carrier Plate for Preparing Package Substrate, Package Substrate Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites - US124514472025Substrate Embedded with Integrated Inductor and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites