4 Patents
- US123158352025Pre-packaged Chip, Method of Manufacturing a Pre-packaged Chip, Semiconductor Package and Method of Manufacturing a Semiconductor Package
Infineon Technologies AG
0 cites - US121010302024Multi-level Inverting Buck-boost Converter Architecture
INFINEON TECHNOLOGIES AUSTRIA AG
0 cites - 0 cites
- US118519572023Systems and Methods for Sensing Engagement in Hazardous Rated Environments
Hydril USA Distribution LLC
0 cites