Juan Arturo Jerez

2 Patents

• US124966592025

  Method of Optimizing Laser Cutting of Wafers for Producing Integrated Circuit Dies

  Skyworks Solutions, Inc.

  0 cites
• US117017392023

  Method of Optimizing Laser Cutting of Wafers for Producing Integrated Circuit Dies

  Skyworks Solutions, Inc.

  0 cites