Ju Il Eom

7 Patents

• US125015392025

  Substrate Including a Reference Voltage Layer Having an Impedance Calibrator

  SK Hynix Inc.

  0 cites
• US120215152024

  Semiconductor Chip Including Chip Pads of Different Surface Areas, and Semiconductor Package Including the Semiconductor Chip

  SK Hynix Inc.

  0 cites
• US120150152024

  Semiconductor Package and Semiconductor Module Including the Same

  SK Hynix Inc.

  0 cites
• US117423402023

  Semiconductor Package Including Stacked Semiconductor Chips

  SK Hynix Inc.

  0 cites
• US116826272023

  Semiconductor Package Including an Interposer

  SK Hynix Inc.

  0 cites
• US116826432023

  Semiconductor Chip Having Chip Pads of Different Surface Areas, and Semiconductor Package Including the Same

  SK Hynix Inc.

  0 cites
• US116056152023

  Semiconductor Package and Semiconductor Module Including the Same

  SK Hynix Inc.

  0 cites