12 Patents
- US125816672026Multistack Metal-insulator-metal (MIM) Structure Using Spacer Formation Process for Heterogeneous Integration with Discrete Capacitors
International Business Machines Corporation
0 cites - US123640042025Dummy Fin Contact in Vertically Stacked Transistors
International Business Machines Corporation
0 cites - US123005772025Heterogeneous Integrated Multi-chip Cooler Module
International Business Machines Corporation
0 cites - 0 cites
- US121676122024Back-side Memory Element with Local Memory Select Transistor
International Business Machines Corporation
0 cites - US121193352024Interconnection Structures for High Bandwidth Data Transfer
International Business Machines Corporation
0 cites - US118551912023Vertical FET with Contact to Gate Above Active Fin
International Business Machines Corporation
0 cites - US117569572023Reducing Gate Resistance in Stacked Vertical Transport Field Effect Transistors
International Business Machines Corporation
0 cites - US117106692023Precision Thin Electronics Handling Integration
International Business Machines Corporation
0 cites - US115878962023Transferrable Pillar Structure for Fanout Package or Interconnect Bridge
International Business Machines Corporation
0 cites - US115748752023Multi-chip Package Structures Having Embedded Chip Interconnect Bridges and Fan-out Redistribution Layers
International Business Machines Corporation
0 cites - US115630032023Fin Top Hard Mask Formation After Wafer Flipping Process
International Business Machines Corporation
0 cites