Joseph Van Nausdle

3 Patents

• US125754152026

  Keep Out Zone with Hydrophobic Surface for Integrated Circuit (IC) Package

  SK Hynix NAND Product Solutions Corp.

  0 cites
• US121304822024

  Hydrophobic Feature to Control Adhesive Flow

  Intel Corporation

  0 cites
• US120682222024

  Dummy Die Structures of a Packaged Integrated Circuit Device

  Intel Corporation

  0 cites