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Inventors
Joseph Minacapelli
Sunnyvale, CA
US
2 patents
3 Patents
US11973060
2024
Extended Through Wafer Vias for Power Delivery in Face-to-face Dies
NVIDIA Corporation
0 cites
US11699662
2023
Face-to-face Dies with Probe Pads for Pre-assembly Testing
NVIDIA Corporation
0 cites
US11616023
2023
Face-to-face Dies with a Void for Enhanced Inductor Performance
NVIDIA Corporation
0 cites