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Inventors
Josef Maerz
Oberhaching
DE
5 patents
4 Patents
US12575429
2026
Semiconductor Package Having a Lead Frame and a Clip Frame
Infineon Technologies AG
0 cites
US12094807
2024
Stacked Transistor Chip Package with Source Coupling
Infineon Technologies AG
0 cites
US11903132
2024
Power Electronic Assembly Having a Laminate Inlay and Method of Producing the Power Electronic Assembly
Infineon Technologies AG
0 cites
US11632860
2023
Power Electronic Assembly and Method of Producing Thereof
Infineon Technologies AG
0 cites