Josef Hoeglauer

10 Patents

• US125754292026

  Semiconductor Package Having a Lead Frame and a Clip Frame

  Infineon Technologies AG

  0 cites
• US122372462025

  Semiconductor Devices Including Parallel Electrically Conductive Layers

  Infineon Technologies AG

  0 cites
• US122180382025

  Leadframe, Semiconductor Package and Method

  Infineon Technologies Austria AG

  0 cites
• US122059192025

  Method of Processing a Semiconductor Wafer, Semiconductor Die, and Method of Producing a Semiconductor Module

  Infineon Technologies AG

  0 cites
• US120877402024

  Method of Forming a Semiconductor Module

  Infineon Technologies Austria AG

  0 cites
• US120274362024

  Package with Clip Having Through Hole Accommodating Component-related Structure

  Infineon Technologies AG

  0 cites
• US119967712024

  Power Semiconductor System Having an Inductor Module Attached to a Power Stage Module

  Infineon Technologies Austria AG

  0 cites
• US119786922024

  Semiconductor Package, Semiconductor Module and Methods for Manufacturing a Semiconductor Package and a Semiconductor Module

  Infineon Technologies Austria AG

  0 cites
• US118174302023

  Semiconductor Module

  Infineon Technologies Austria AG

  0 cites
• US117768822023

  Method of Fabricating a Semiconductor Package

  Infineon Technologies Austria AG

  0 cites