2 Patents
- US121913462025Selective Area Metal Process for Improved Metallurgical Bonding of Aluminum to Copper for Integrated Passive Devices in a Semiconductor Device
SARAS MICRO DEVICES, Inc.
0 cites - US121366012024Single-sided Embeddable Capacitors for Packaged Semiconductor Devices
SARAS MICRO DEVICES, Inc.
0 cites