9 Patents
- US123241262025Actively Cooled Heat-dissipation Lids for Computer Processors and Processor Assemblies
Jetcool Technologies Inc.
0 cites - US122887332025Conformal Cooling Assembly with Substrate Fluid-proofing for Multi-die Electronic Assemblies
Jetcool Technologies Inc.
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- US121006432024Thermal Management of Electronics Using Co-located Microjet Nozzles and Electronic Elements
Jetcool Technologies, Inc.
0 cites - 0 cites
- US120161572024Actively Cooled Heat-dissipation Lids for Computer Processors and Assemblies
Jetcool Technlologies Inc.
0 cites - 0 cites
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