Patents/Inventors

Jooyoung Oh

Anyang-siKR5 patents

4 Patents

US125990282026
Semiconductor Packages Having Adhesive Members
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124530092025
Printed Circuit Board and Semiconductor Package Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118626082024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118429772023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites